TEM Air-Free Transfer Technical Specs Brochure

Transfer air-sensitive samples to the TEM under vacuum or inert gas using dedicated sample holders for 3 mm grids or MEMS heating and/or biasing chips.

Technical Specs

1580 Series Biasing Transfer

3 mm Grid Transfer

High Vacuum Transfer

Yes

Inert Gas Transfer

Yes

Sample Substrate

MEMS chips

3 mm TEM grid

Number of Electrical Contacts

Contact Type

Direct chip contact

N/A

Settled Resolution

Up to TEM resolution

High Temperature On-Chip Sample Heating

Yes

EELS/EDS Compatible

Yes

Available For:

www.hummingbirdscientific.com ©Hummingbird Scientific 2026 -The specifications provided are subject to change without notice.

Key Features and Capabilities

Vacuum or Inert-Gas Transfer for Air-Sensitive TEM Specimens

Protect air-sensitive specimens during glovebox-to-TEM transfer using sealed high-vacuum or inert-gas environments

Choose Between 3 mm Grid and MEMS Chip Holder Variants

Dedicated holder variants support 3 mm TEM grids for routine characterization or MEMS chips for advanced in-situ heating and electrical biasing experiments

Nine Low-Noise Electrical Contacts (MEMS Variant)

Perform low-noise in-situ electrical measurements using up to nine direct chip electrical contacts with individually shielded coaxial connections

60+ In-Stock TEM Heating and Biasing Chip Configurations (Chip Sample Substrate Variant)

Keep experiments moving with in-stock MEMS chips for heating, electrical biasing, and advanced in-situ TEM characterization

Integrated Heating (Chip Sample Substrate Variant)

Optional add on

Perform variable-temperature in-situ experiments on air-sensitive materials with integrated MEMS heating to >1000 °C

www.hummingbirdscientific.com ©Hummingbird Scientific 2026 -The specifications provided are subject to change without notice.

Built for Diverse Applications

Semiconductors

Investigate device operation, degradation, and failure in semiconductor materials.

Operando Device Switching

Electromigration Studies

Defect Evolution

Thermal Reliability Testing

Failure Analysis

Quantum Materials

Investigate phase transitions, defect dynamics, and electronic properties in quantum materials.

Phase Transitions

Electronic Properties

Defect Dynamics

Quantum Heterostructures

Domain Evolution

Illustration of battery material particles and spectroscopy

Battery Materials

Directly visualize battery cycling, ion transport, dendrite formation, interface evolution, and structural changes.

Charge-Discharge Cycling

Featured Research

Inert transfer of air-sensitive Cr-LiF thin film cathodes for in-situ electrical cycling under TEM

Longterm behavior (a) Specific discharge capacity vs cycle number for a Cr-LiF cathode cycled at 1C (black) and 5C (teal). Coulombic efficiency is shown for all cycles on the right axis. (b) Nyquist representation of PEIS spectra taken after different cycle numbers. (c) Resistance vs cycle number for fitted resistance values of the LiPON, RC1,and RC2 contributions. The equivalent circuit used to fit the PEIS spectra is shown. (d) STEM-EDX maps of Cr, F, and Ti for samples after 25 cycles and 1564 cycles at 1C (shown as stars on panel(a)).

Reference: Joel Casella, et al, Communications Materials (2026). DOI: 10.1038/s43246-026-01121-0

This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License. To view a copy of this license, visit http://creativecommons.org/licenses/by-nc-nd/4.0/.

www.hummingbirdscientific.com ©Hummingbird Scientific 2026 -The specifications provided are subject to change without notice.

Selected Publications

Joel Casella, Morzy Jȩdrzej, Vittorio Montanelli, Felix C. Mocanu, Arnold Müller, Moritz H. Futscher, Marta D. Rossell, M. Saiful Islam, Maksym Yarema, Yaroslav E. Romanyuk. “Cr-LiF as a high energy density conversion-type cathode for Li-ion solid-state batteries”. Communications Materials (2026)

DOI:

10.1038/s43246-026-01121-0

Masahiko Shimizu, Yuta Inami, Ryuichi Shimogawa, Takeshi Matsuo, Yu Fujikata, Hajime Matsumoto, Kazutaka Mitsuishi, Ayako Hashimoto. “Atomic-scale elucidation of formation and structure in high-performance Re-Ge nanocatalysts”. Nanoscale (2026)

DOI:

10.1039/D5NR05414A

Eric Stach, James Horwath, Nikhilendra Singh, Timothy Arthur, Daan Hein Alsem, Norman Salmon. “Understanding the Relationship Between Air Exposure, Electron Dose and Beam Damage in Solid Electrolyte Materails”. Microscopy and Microanalysis (2020)

DOI:

10.1017/S143192762002423X

TEM Air‑Free Transfer

Key Features and Capabilities

Vacuum or Inert-Gas Transfer for Air-Sensitive TEM Specimens

Choose Between 3 mm Grid and MEMS Chip Holder Variants

Nine Low-Noise Electrical Contacts (MEMS Variant)

60+ In-Stock TEM Heating and Biasing Chip Configurations (Chip Sample Substrate Variant)

Integrated Heating (Chip Sample Substrate Variant)

Built for Diverse Applications

Semiconductors

Quantum Materials

Battery Materials

Featured Research

Selected Publications