TEM Electrical Biasing: Flexible Carrier Brochure

Perform in-situ TEM electrical biasing experiments with 8 electrical contacts, flexible chip carriers, and support for Hummingbird Scientific chips as well as your own custom-fabricated devices.

Technical Specs

1600 Series

Tilt Range

±45° depending on microscope and pole piece

Number of Electrical Contacts

Contact Type

Flexible wirebond contacts or fixed spring contact

Carrier

Removable sample carrier

Carrier Compatibility

Any standard TEM sample supports or customer developed substrates

Sample Size

Fits up to 4 mm x 10 mm samples

Wiring

Low-noise shielded wiring

Available For:

www.hummingbirdscientific.com ©Hummingbird Scientific 2026 -The specifications provided are subject to change without notice.

Key Features and Capabilities

Flexible Chip-Carrier Architecture

Support Hummingbird Scientific chips, user-developed chips, and custom devices on the same holder

Eight Low-Noise Electrical Contacts

Perform sensitive electrical measurements through eight independently shielded electrical contacts

Custom Chip-Carrier Geometries

Optional add on

Expand experimental capabilities with application-specific carrier designs for unique devices and samples

www.hummingbirdscientific.com ©Hummingbird Scientific 2026 -The specifications provided are subject to change without notice.

Built for Diverse Applications

Semiconductors

Investigate device operation, degradation, and failure in semiconductor materials.

Operando Device Switching

Electromigration Studies

Defect Evolution

Thermal Reliability Testing

Failure Analysis

Quantum Materials

Investigate phase transitions, defect dynamics, and electronic properties in quantum materials.

Phase Transitions

Electronic Properties

Defect Dynamics

Quantum Heterostructures

Domain Evolution

Illustration of battery material particles and spectroscopy

Battery Materials

Directly visualize battery cycling, ion transport, dendrite formation, interface evolution, and structural changes.

Charge-Discharge Cycling

Featured Research

Operando electron holography of trapped charges in multilayer HfO₂–Al₂O₃ nanocapacitors

a,f) FIB lamellae schematic and TEM image of stack A: HfO₂/Al₂O₃/HfO₂ and stack B: Al₂O₃/HfO₂/Al₂O₃. b,g) Sketches of stacks A and B. c,h) TEM images layers of the nanocapacitors A and B. d,i) Phase maps of projected electric potential obtained by electron holography for nanocapacitors A and B with an applied bias of +6 V. e,j) Phase maps for nanocapacitors A and B with an applied bias of -6 V. Scale bars are 20 nm in (c) and (h).

Reference: Leifeng Zhang, et al. Advanced Materials (2025). DOI: 10.1002/adma.202413691

www.hummingbirdscientific.com ©Hummingbird Scientific 2026 -The specifications provided are subject to change without notice.

Selected Publications

Lina Daza-Llanos, Sandra Stangebye, Eric J. Lang, Khalid Hattar, Olivier Pierron, Josh Kacher. “Influence of irradiation damage on stress-assisted grain growth in ultrafine grained Au thin films using in situ transmission electron microscopy mechanical testing”. Materials Science and Engineering: A (2025)

DOI:

10.1016/j.msea.2025.149256

Paul Miller, Tyler Hill, Mark Polking, Frances Ross. “High Throughput Specimen for in-situ Transmission Electron Microscopy”. Microscopy and Microanalysis (2025)

DOI:

10.1093/mam/ozaf048.896

Thomas R. Koenig, Hongyu Wang, Yong Zhu, Ankit Gupta, Garritt J. Tucker, Gregory B. Thompson. “In situ characterization of thermomechanically loaded solution strengthened, nanocrystalline nickel alloys”. Acta Materialia (2024)

DOI:

10.1016/j.actamat.2023.119462

Jared J. Lodico, Matthew Mecklenburg, Ho Leung Chan, Yueyun Chen, Xin Yi Ling, B.C. Regan. “Operando spectral imaging of the lithium ion battery's solid-electrolyte interphase”. Science Advances (2023)

DOI:

10.1126/sciadv.adg5135

Sandra Stangebye, Xing Liu, Lina Daza Llanos, Yichen Yang, Ting Zhu, Josh Kacher, Olivier Pierron. “Comparison of electrical sensing and image analysis for in situ transmission electron microscopy nanomechanical testing of thin films”. Thin Solid Films (2023)

DOI:

10.1016/j.tsf.2023.140125