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TEM Electrical Biasing: Flexible Carrier Sample Holder

Operando heating, biasing under environmental conditions

Technical Specs
1600 Series
Tilt Range
±45° depending on microscope and pole piece
Number of Electrical Contacts
8
Contact Type
Flexible wirebond contacts or fixed spring contact
Carrier
Removable sample carrier
Carrier Compatibility
Any standard TEM sample supports or customer developed substrates
Sample Size
Fits up to 4 mm x 10 mm samples
Wiring
Low-noise shielded wiring
Instrument Type
TEM

Available For:

Expand your in-situ TEM electrical biasing capabilities with a flexible platform that supports both Hummingbird Scientific chips and user-developed devices through custom chip-carrier geometries

Key Features and Capabilities

Custom Chip-Carrier Geometries

Optional add on
Expand experimental capabilities with application-specific carrier designs for unique devices and samples

Eight Low-Noise Electrical Contacts

Perform sensitive electrical measurements through eight independently shielded electrical contacts

Flexible Chip-Carrier Architecture

Support Hummingbird Scientific chips, user-developed chips, and custom devices on the same holder

How it works

Hummingbird Scientific electrical biasing chips, user-developed chips, and custom devices are wire bonded to interchangeable chip carriers before being inserted into the holder tip. Spring-loaded electrical contacts automatically establish reliable electrical connections, while individually shielded wiring minimizes electrical noise to support sensitive electrical measurements and repeatable experimental performance.

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During in-situ TEM experiments, electrical stimuli are applied while structural, morphological, and chemical changes are observed using conventional TEM imaging together with analytical techniques such as EDS and EELS. The platform supports a broad range of electrical characterization workflows, from routine device testing to advanced operando materials research.

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The interchangeable carrier architecture enables new chip designs, custom devices, and specialized sample geometries to be accommodated without changing the overall experimental platform. This flexible approach allows experimental capabilities to expand as research priorities, device architectures, and electrical characterization requirements evolve.