Protect air-sensitive and reactive materials during transfer to the TEM with dedicated holders for conventional TEM/STEM imaging of 3 mm grids or in-situ MEMS chips for heating and electrical biasing experiments

Air-Free Transfer from Glovebox to TEM

The TEM Air-Free Transfer Sample Holder is a sealed transfer holder that enables air-sensitive materials to be transferred from an inert atmosphere glovebox to the TEM without atmospheric exposure. Two dedicated holder variants are available: one for conventional TEM/STEM imaging using 3 mm TEM grids, and another for in-situ experiments using MEMS heating and electrical biasing chips with 9 electrical contacts. Together, they enable characterization of highly reactive materials in their native state.

Designed for Air-Sensitive Materials Research

Investigate air-sensitive materials including lithium and other alkali metals, solid-state batteries, catalysts, metal–organic frameworks (MOFs), quantum materials, metal hydrides, and other reactive nanomaterials in their native pristine states. By maintaining air-free conditions from glovebox to TEM, the holder enables accurate structural, chemical, and analytical characterization of materials that rapidly oxidize, hydrate, or degrade upon atmospheric exposure.

Reveal Intrinsic Material Behavior

For many reactive materials, even brief atmospheric exposure can alter surfaces, interfaces, and electrochemical states before characterization begins. By maintaining a protected transfer environment, the holder enables more representative analysis and greater confidence that observed material behavior reflects intrinsic properties rather than artifacts introduced during sample handling. An optional MEMS heating and electrical biasing configuration further extends these capabilities, enabling controlled thermal and electrical in-situ experiments on air-sensitive materials while preserving their initial state.

TEM Air-Free Transfer Sample Holder

Hummingbird Advantages:

  • Protect air-sensitive samples during transfer from an inert atmosphere glovebox or sample preparation chamber to the TEM.
  • Support for both high-vacuum or inert-gas transfer workflows for diverse sample and experimental requirements.
  • Prevent sample oxidation, hydration, and surface contamination before TEM characterization.
  • Choose from dedicated sample holders for conventional 3 mm TEM grids or MEMS heating and electrical biasing chips.
  • Enable the characterization of battery materials, semiconductor devices, catalysts, and other air-sensitive materials in their native pristine states.
  • Choose the MEMS chip holder variant to perform thermal and electrical in-situ experiments using chips with up to 9 electrical contacts.
Technical Specs
1580 Series Biasing Transfer
3 mm Grid Transfer
High Vacuum Transfer
Yes
Yes
Inert Gas Transfer
Yes
Yes
Sample Substrate
MEMS chips
3 mm TEM grid
Number of Electrical Contacts
9
0
Contact Type
Direct chip contact
N/A
Settled Resolution
Up to TEM resolution
Up to TEM resolution
High Temperature On-Chip Sample Heating
Yes
Yes
EELS/EDS Compatible
Yes
Yes

Available For:

How it Works

The TEM Air-Free Transfer Sample Holder integrates a sealed transfer mechanism with dedicated holder platforms for conventional 3 mm TEM grids or MEMS heating and electrical biasing chips. Samples are prepared inside an inert atmosphere glovebox before being mounted onto the appropriate substrate and loaded into the holder. The transfer tip is then sealed under either high vacuum or an inert gas atmosphere for transfer to the TEM.

Once loaded, the holder seals the specimen under either high vacuum or an inert gas atmosphere, allowing it to be transferred to the TEM without exposure to oxygen or moisture. After the holder is inserted into the microscope, the sealed transfer tip is opened inside the TEM vacuum, preserving the specimen's pristine native state until characterization begins.

The 3 mm grid holder supports conventional TEM/STEM imaging and compatible analytical techniques, while the MEMS holder enables controlled in-situ heating up to above 1000 °C and electrical biasing experiments on preserved specimens. Together, these dedicated holder platforms allow researchers to investigate highly reactive materials without compromising their initial state prior to imaging or controlled stimulation.

Key Features and Capabilities

Vacuum or Inert-Gas Transfer for Air-Sensitive TEM Specimens

Protect air-sensitive specimens during glovebox-to-TEM transfer using sealed high-vacuum or inert-gas environments

Choose Between 3 mm Grid and MEMS Chip Holder Variants

Dedicated holder variants support 3 mm TEM grids for routine characterization or MEMS chips for advanced in-situ heating and electrical biasing experiments

Nine Low-Noise Electrical Contacts (MEMS Variant)

Perform low-noise in-situ electrical measurements using up to nine direct chip electrical contacts with individually shielded coaxial connections

60+ In-Stock TEM Heating and Biasing Chip Configurations (Chip Sample Substrate Variant)

Keep experiments moving with in-stock MEMS chips for heating, electrical biasing, and advanced in-situ TEM characterization

Optional add-on feature
Integrated Heating (Chip Sample Substrate Variant)

Perform variable-temperature in-situ experiments on air-sensitive materials with integrated MEMS heating to >1000 °C

Featured Research

Inert transfer of air-sensitive Cr-LiF thin film cathodes for in-situ electrical cycling under TEM

The TEM Biasing Air-free Transfer sample holder was used to transfer air-sensitive, lithiated Cr-LiF thin film cathodes to the TEM for in-situ electrical cycling. Co-evaporation was used to fabricate heterogeneous two-phase chromium-based transition metal fluoride (TMF) thin films with tunable stoichiometric ratios for lithium-ion solid state battery development. A Cr–LiF cathode (1.1:2) showed strong thin-film performance, with better high-rate behavior than Fe–LiF cathodes. Extended cycling formed a new nanostructure that improved kinetics with some capacity loss, resulting in stable operation over hundreds of cycles.

Reference: Joel Casella, et al, Communications Materials (2026). DOI: 10.1038/s43246-026-01121-0

This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License. To view a copy of this license, visit http://creativecommons.org/licenses/by-nc-nd/4.0/.

High Impact Publications

Discover how researchers use the Hummingbird Scientific TEM Air-Free Transfer Sample Holder to characterize air-sensitive materials while preserving their native structure and chemistry.

Cr-LiF as a high energy density conversion-type cathode for Li-ion solid-state batteries

Joel Casella, Morzy Jȩdrzej, Vittorio Montanelli, Felix C. Mocanu, Arnold Müller, Moritz H. Futscher, Marta D. Rossell, M. Saiful Islam, Maksym Yarema, Yaroslav E.Romanyuk

Communications Materials

2026
Atomic-scale elucidation of formation and structure in high-performance Re-Ge nanocatalysts

Masahiko Shimizu, Yuta Inami, Ryuichi Shimogawa, Takeshi Matsuo, Yu Fujikata, Hajime Matsumoto, Kazutaka Mitsuishi, Ayako Hashimoto

Nanoscale

2026
Understanding the Relationship Between Air Exposure, Electron Dose and Beam Damage in Solid Electrolyte Materails

Eric Stach, James Horwath, Nikhilendra Singh, Timothy Arthur, Daan Hein Alsem, Norman Salmon

Microscopy and Microanalysis

2020

Software

Spend less time managing equipment and more time generating results. Hummingbird Control Software provides intuitive control of heating and biasing functions, including temperature set points, closed-loop heating behavior, and voltage sweep workflows when configured with the system.

Hummingbird Connect can support the broader software strategy by connecting holder operation, microscope context, imaging workflows, and experiment metadata. Together, these software tools help improve reproducibility, experiment setup, data organization, and long-term usability for in-situ TEM heating and biasing experiments.

Built on Engineering Excellence

Hummingbird Scientific designs, machines, assembles, tests, and services its products in-house. Our integrated in-house engineering, precision manufacturing, microfabrication, software development, applications, and service teams enables rapid prototyping and iteration, custom modifications, and direct technical support throughout the life of the instrument.

The TEM Air-Free Transfer Specimen Holder is a direct result of these capabilities. By combining sealed air-free transfer technology, precision holder design, and specialized sample platforms into a unified solution, it enables reliable characterization of oxygen- and moisture-sensitive materials. Dedicated 3 mm grid and MEMS heating and electrical biasing holder variants extend protected transfer workflows from conventional TEM/STEM imaging to advanced in-situ experiments on highly reactive materials.

Need something unique? Our engineers can customize existing transfer holders or develop new solutions to support specialized sample geometries, transfer interfaces, MEMS chip configurations, and emerging air-free characterization workflows.

Frequently Asked Questions

What is a TEM Air-Free Transfer Sample Holder?
What types of experiments can be performed using the TEM Air-Free Transfer Sample Holder?
Which TEM Air-Free Transfer Sample Holder variant is best suited for my experiment?
Can EDS and EELS be performed using the TEM Air-Free Transfer Sample Holder?
How easy is it to set up and use the TEM Air-Free Transfer Sample Holder?
What advantages do Hummingbird Scientific's MEMS chips provide for the TEM Air-Free Transfer Sample Holder?
Can the TEM Air-Free Transfer Sample Holder be customized for specialized experimental requirements?
TEM Air‑Free Transfer
Technical Specs
1580 Series Biasing Transfer
3 mm Grid Transfer
High Vacuum Transfer
Yes
Yes
Inert Gas Transfer
Yes
Yes
Sample Substrate
MEMS chips
3 mm TEM grid
Number of Electrical Contacts
9
0
Contact Type
Direct chip contact
N/A
Settled Resolution
Up to TEM resolution
Up to TEM resolution
High Temperature On-Chip Sample Heating
Yes
Yes
EELS/EDS Compatible
Yes
Yes
Instrument Type
TEM
TEM

Available For:

Full Product Information
Product Specifications
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Integrated Heating (Chip Sample Substrate Variant)